ANADIGICS (NASDAQ: ANAD) is one of 27 publicly-traded companies in the “Integrated Circuits” industry, but how does it contrast to its peers? We will compare ANADIGICS to related companies based on the strength of its institutional ownership, analyst recommendations, earnings, dividends, profitability, risk and valuation.
Valuation & Earnings
This table compares ANADIGICS and its peers gross revenue, earnings per share (EPS) and valuation.
ANADIGICS’s peers have higher revenue and earnings than ANADIGICS. ANADIGICS is trading at a lower price-to-earnings ratio than its peers, indicating that it is currently more affordable than other companies in its industry.
Insider & Institutional Ownership
56.0% of shares of all “Integrated Circuits” companies are owned by institutional investors. 14.3% of shares of all “Integrated Circuits” companies are owned by insiders. Strong institutional ownership is an indication that large money managers, hedge funds and endowments believe a stock will outperform the market over the long term.
This is a breakdown of current ratings for ANADIGICS and its peers, as provided by MarketBeat.
||Strong Buy Ratings
As a group, “Integrated Circuits” companies have a potential upside of 15.01%. Given ANADIGICS’s peers higher possible upside, analysts plainly believe ANADIGICS has less favorable growth aspects than its peers.
This table compares ANADIGICS and its peers’ net margins, return on equity and return on assets.
||Return on Equity
||Return on Assets
ANADIGICS peers beat ANADIGICS on 8 of the 8 factors compared.
ANADIGICS Company Profile
ANADIGICS, Inc. is engaged in the designing and manufacturing of radio frequency (RF) semiconductor solutions for infrastructure and mobile communications and data transmission markets. The Company’s product portfolio includes line amplifiers, reverse path amplifiers, power amplifiers (PAs) and front-end integrated circuits (FEIC). The Company designs, develops, and manufactures RFIC’s primarily using GaAs compound semiconductor substrates with various process technologies, including metal semiconductor field effect transistor (MESFET), pseudomorphic high-electron-mobility transistor (pHEMT) and heterojunction bipolar transistor (HBT). The Company’s InGaP-Plus technology, combines InGaP HBT and pHEMT processes on a single substrate and integrates the PA function and the RF active switch function on the same die. Additionally, the Company offers VCSEL process technology. The Company fabricates its ICs in its six-inch diameter GaAs wafer fabrication facility.
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