Media stories about ASE Group (NYSE:ASX) have been trending somewhat positive this week, Accern reports. The research group identifies positive and negative news coverage by reviewing more than 20 million blog and news sources in real time. Accern ranks coverage of companies on a scale of -1 to 1, with scores nearest to one being the most favorable. ASE Group earned a daily sentiment score of 0.15 on Accern’s scale. Accern also assigned media coverage about the semiconductor company an impact score of 46.7214615070806 out of 100, meaning that recent news coverage is somewhat unlikely to have an impact on the stock’s share price in the immediate future.
Separately, Zacks Investment Research downgraded ASE Group from a “buy” rating to a “hold” rating in a research note on Tuesday, April 3rd.
NYSE:ASX traded down $0.06 during mid-day trading on Friday, reaching $7.05. 640,424 shares of the stock were exchanged, compared to its average volume of 917,433. The company has a market capitalization of $11,665.70, a PE ratio of 16.40, a P/E/G ratio of 1.90 and a beta of 0.73. The company has a quick ratio of 1.11, a current ratio of 1.34 and a debt-to-equity ratio of 0.22. ASE Group has a 1 year low of $5.86 and a 1 year high of $7.52.
ASE Group (NYSE:ASX) last released its quarterly earnings results on Thursday, February 1st. The semiconductor company reported $0.12 earnings per share (EPS) for the quarter. The firm had revenue of $2.73 billion for the quarter. ASE Group had a return on equity of 12.10% and a net margin of 7.95%. sell-side analysts anticipate that ASE Group will post 0.47 EPS for the current fiscal year.
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About ASE Group
Advanced Semiconductor Engineering, Inc provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services segments. The company offers packaging services, including various packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions.
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