ChipMOS Technologies Inc – (NASDAQ:IMOS) declared an annual dividend on Thursday, August 9th, NASDAQ reports. Shareholders of record on Friday, October 19th will be given a dividend of 0.135 per share by the semiconductor company on Friday, October 19th. This represents a yield of 0.88%. The ex-dividend date of this dividend is Thursday, October 18th.
ChipMOS Technologies has raised its dividend by an average of 4.0% annually over the last three years.
NASDAQ:IMOS opened at $15.10 on Friday. The company has a quick ratio of 2.06, a current ratio of 2.48 and a debt-to-equity ratio of 0.41. The stock has a market capitalization of $656.05 million, a price-to-earnings ratio of 15.89 and a beta of 0.48. ChipMOS Technologies has a 1 year low of $12.69 and a 1 year high of $21.64.
ChipMOS Technologies (NASDAQ:IMOS) last posted its quarterly earnings data on Thursday, August 9th. The semiconductor company reported $0.10 earnings per share for the quarter, missing the consensus estimate of $0.17 by ($0.07). The firm had revenue of $147.60 million for the quarter, compared to analyst estimates of $145.24 million. ChipMOS Technologies had a return on equity of 2.91% and a net margin of 2.71%. The firm’s quarterly revenue was down 1.1% on a year-over-year basis. During the same period in the prior year, the company earned $0.25 earnings per share.
Several research analysts have recently weighed in on IMOS shares. ValuEngine cut ChipMOS Technologies from a “hold” rating to a “sell” rating in a research report on Wednesday, September 12th. BidaskClub raised ChipMOS Technologies from a “strong sell” rating to a “sell” rating in a research report on Tuesday, September 18th.
ChipMOS Technologies Company Profile
ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high integration and high precision integrated circuits, and related assembly and testing services. It provides a range of back-end assembly and test services, including engineering test, wafer probing and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other flat-panel display driver semiconductors.
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