Electro Scientific Industries (ESIO) Hits New 1-Year Low at $15.02

Electro Scientific Industries, Inc. (NASDAQ:ESIO) shares hit a new 52-week low during mid-day trading on Friday . The stock traded as low as $15.02 and last traded at $15.04, with a volume of 542159 shares. The stock had previously closed at $15.85.

Several research analysts have issued reports on ESIO shares. ValuEngine cut shares of Electro Scientific Industries from a “buy” rating to a “hold” rating in a report on Friday, September 7th. BidaskClub cut shares of Electro Scientific Industries from a “sell” rating to a “strong sell” rating in a report on Tuesday, September 11th. Finally, Zacks Investment Research cut shares of Electro Scientific Industries from a “hold” rating to a “strong sell” rating in a report on Wednesday, August 8th. Two equities research analysts have rated the stock with a sell rating, one has given a hold rating and four have given a buy rating to the company. Electro Scientific Industries has an average rating of “Hold” and an average target price of $30.40.

The company has a debt-to-equity ratio of 0.04, a quick ratio of 2.94 and a current ratio of 4.22. The firm has a market cap of $561.91 million, a price-to-earnings ratio of 5.72, a P/E/G ratio of 0.67 and a beta of 1.12.

Electro Scientific Industries (NASDAQ:ESIO) last released its quarterly earnings data on Wednesday, August 1st. The semiconductor company reported $0.96 earnings per share for the quarter, beating the consensus estimate of $0.85 by $0.11. Electro Scientific Industries had a net margin of 35.60% and a return on equity of 47.09%. The firm had revenue of $110.62 million during the quarter, compared to analysts’ expectations of $104.64 million. During the same period in the previous year, the company earned $0.38 earnings per share. The firm’s quarterly revenue was up 52.2% on a year-over-year basis. As a group, analysts anticipate that Electro Scientific Industries, Inc. will post 2.06 EPS for the current fiscal year.

In other news, Director Raymond A. Link sold 6,000 shares of the business’s stock in a transaction that occurred on Thursday, August 9th. The shares were sold at an average price of $23.01, for a total transaction of $138,060.00. Following the completion of the transaction, the director now directly owns 73,643 shares of the company’s stock, valued at $1,694,525.43. The transaction was disclosed in a filing with the Securities & Exchange Commission, which can be accessed through the SEC website. 1.53% of the stock is owned by insiders.

Hedge funds and other institutional investors have recently made changes to their positions in the stock. Swiss National Bank grew its position in Electro Scientific Industries by 14.2% during the second quarter. Swiss National Bank now owns 58,000 shares of the semiconductor company’s stock valued at $915,000 after buying an additional 7,200 shares during the period. Fortis Advisors LLC bought a new stake in Electro Scientific Industries during the second quarter valued at approximately $123,000. Bridge City Capital LLC bought a new stake in Electro Scientific Industries during the second quarter valued at approximately $1,023,000. DDD Partners LLC grew its position in Electro Scientific Industries by 1.5% during the second quarter. DDD Partners LLC now owns 332,852 shares of the semiconductor company’s stock valued at $5,249,000 after buying an additional 4,935 shares during the period. Finally, Eqis Capital Management Inc. grew its position in Electro Scientific Industries by 164.5% during the second quarter. Eqis Capital Management Inc. now owns 27,902 shares of the semiconductor company’s stock valued at $440,000 after buying an additional 17,353 shares during the period. Institutional investors own 89.30% of the company’s stock.

About Electro Scientific Industries (NASDAQ:ESIO)

Electro Scientific Industries, Inc, together with its subsidiaries, supplies laser-based microfabrication solutions for the microtechnology industry worldwide. The company provides printed circuit board laser drilling products, including laser via drilling systems for electrical interconnect applications that require dimensions to create electrical connections between layers in flexible circuits, high-density circuit boards, and interconnect packages; micro via drilling technology that addresses the changing applications in interconnect packages, multichip modules, and high density interconnect circuit boards; and ultraviolet laser processing systems that employ technology in lasers, optics, and motion control.

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